By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher
This ebook explains one of many most well-liked themes in instant and digital units neighborhood, particularly the instant conversation at mmWave frequencies, particularly on the 60 GHz ISM band. It presents the reader with wisdom and methods for mmWave antenna layout, review, antenna and chip packaging. Addresses useful engineering matters equivalent to RF fabric review and choice, antenna and packaging specifications, production tolerances, antenna and approach interconnections, and antenna one of many first books to debate the rising study and alertness components, really chip programs with built-in antennas, wafer scale mmWave phased arrays and imaging encompasses a reliable variety of case reviews to help realizing offers the antenna and packaging applied sciences for the most recent and rising functions with the emphases on antenna integrations for sensible purposes corresponding to instant USB, instant video, part array, car collision avoidance radar, and imaging
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Extra info for Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits
Process options for lithography, machining, metallization, wafer thinning and assembly are presented. The chapter concludes with an example silicon-based mmWave package with integral antenna and its measurement results. Through this brief introduction, it is hoped that the reader perceives the subject matter of this book as the beginning of a new and exciting wireless world and it is as wide a set of topics as it is rich and deep in novelty, complexity and challenge. Although the surface may only be scratched here, uncovering a few shiny gems, the authors’ goal is that the reader is as captured by this ﬁeld as they are and will become similar pioneers in this new area, contributing to and growing this body of work so that all may reap the beneﬁts of this emerging set of technologies and may launch a new generation of wireless applications and devices.
Wachnik, and K. Walter, ‘Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems’, Semiconductor Science and Technology 22(1) (2007), S236– S243.  S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J. Grzyb, C. Haymes, B. Gaucher, and M. Soyuer, ‘A silicon 60 GHz receiver and transmitter chipset for broadband communications’, IEEE J. SolidState Circuits 41(12) (2006), 2820–30.  B. Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C. Haymes, ‘A silicon 60GHz receiver and transmitter chipset for broadband communications’, IEEE ISSCC Dig.
Driving the integration level of mmWave circuits on the chip level is key for the success of future mmWave applications. 3 Time to Market Package design cycles may be lengthy. Much depends on the experience of designers and the quality of electromagnetic simulations. The fact that most of today’s systems and packages are based on discrete components, with individually tuned connection in between, slows down the time to market for such systems. 4 Reliability Great emphasis must be placed on system reliability.