By D. A. Beck (auth.), Gerald A. Walker (eds.)
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Extra resources for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
The only approved source is Eccospheres-R glass microballoons Emerson and Cuming, Inc. 3 Hardener - The only hardener approved for use in this process is diethanolamine. It is available from the following sources: Diethanolamine Diethanolamine Diethanolamine Cat. No. 1598 Diethanolamine Cat. No. D-45 Primary sources Union Carbide Chemicals Co. 2770 Leonis Boulevard Los Angeles, California Dow Chemical Company Midland, Michigan Secondary sources Distillation Products Industries Division Eastman Kodak Company Rochester 3, New York Fisher Scientific Company 2850 S.
Due to its high strengtb and highE. itis going to be fairly rugged from a forming standpoint. but I can't give you any comparative figures. Que s t ion: Mr. Beckman. Sperry Gyroscope. Great Neck. New York. I have a question in regard to joining beryllium-to-beryllium eitber by riveting. welding, or adhesion. Do you use any. and what do you prefer? An s w e r: Well. it can be welded; it can be spot welded; it can be riveted, of course. For riveting it may be in tbe same category as magnesium. You use 5056 or some of the similar types of aluminum alloys for riveting magnesium.
ASME (Dec. 2, 1958).  G. W. Painter and B. W. 3, Project 01783.  R. P. Thorn, "Controlling Structural Response of Electronic Chassis," First Intern. Electronic Circuit Packaging Symposium Papers.  B. W. Campbell, "Elastomers Applied to Structural Damping,· ASME Paper No. 60-RP-19 (October 9-12, 1960). DISCUSSION Que s t ion: Herb Flatto, Hughes, Fullerton. Have you made any investigation into controlling the response of welded modules with increased component density and potting compounds which in themselves result in damping of the structure?